CHIP SHINE Debuts at SEMICON Southeast Asia 2024: Showcasing the Cutting-edge Charisma of the Semiconductor Industry
CHIP SHINE will participate in the SEMICON exhibition in Malaysia from May 28th to May 30th, 2024. The exhibits will include ICT test probes, POGO PINs, semiconductor packaging test PINs and sockets, as well as wafer-level test probes and modules.
CHIP SHINE will participate in the SEMICON exhibition in Malaysia from May 28th to May 30th, 2024. The exhibits will include ICT test probes, POGO PINs, semiconductor packaging test PINs and sockets, as well as wafer-level test probes and modules.
This exhibition marks CHIP SHINE's first overseas exhibition, focusing on cutting-edge semiconductor technology,
innovative materials, and high-efficiency equipment to showcase the industry's cutting-edge charm.
CHIP SHINE has carefully prepared the exhibits, including ICT test probes and POGO PINs widely used in the industry, as well as PINs and sockets specifically designed for semiconductor packaging testing. Additionally, they will also showcase wafer-level test probes and modules.
CHIP SHINE invites professionals in the semiconductor field to visit and provide guidance, discuss industry trends, share technical experience, and explore collaboration opportunities.